µàÆùÀº ¸¶ÀÌÅ©·Î ¸®¼Ò±×·¡ÇÇ Àç·á¸¦ ¼³°èÇÏ¿© ±âÁ¸ ¸¶ÀÌÅ©·Î ¸®¼Ò±×·¡ÇÇ °øÁ¤À» °³¼±Çϰí, °í±ÞÆÐÅÏÈ °øÁ¤À» Áö¿øÇÕ´Ï´Ù. ArFÆ÷Åä·¹Áö½ºÆ®, KrFÆ÷Åä·¹Áö½ºÆ®, I/G¶óÀÎ Æ÷Åä·¹Áö½ºÆ®, À¯±â ¹Ù´Ú ¹Ý»ç ¹æÁö ÄÚÆÃ(BARC)Àç·á µî ´Ù¾çÇÑ Á¦Ç° ¹× ¼ºñ½º¸¦ Áö¿øÇÕ´Ï´Ù.
1) Photoresist°¢Á¾ °¨±¤Àç, EUV, ArF, KrF, i-¶óÀÎ, g-¶óÀÎ
2) Advanced Overcoats
Æ÷Åä·¹Áö½ºÆ®¿Í ÇÔ²² »ç¿ëµÇ´Â µàÆùÀÇ °í±Þ ¿À¹öÄÚµå ¼ÒÀç´Â °áÇÔÀ» ¹æÁöÇÏ°í ¸®¼Ò±×·¡ÇÇ °øÁ¤ âÀ» °³¼±Çϵµ·Ï ¼³°èµÇ º¸´Ù ¹Ì¼¼ÇÑ ÇÇÃÄ ÆÐÅÏÀÌ °¡´ÉÇÕ´Ï´Ù.
3) Anti-Reflectants & Functional Sublayers
¹Ý»ç¹æÁöÄÚÆÃ ¹× ¼ºê·¹À̾î´Â °øÁ¤ ¹× ¹Ý»çÀ² âÀ» ³ÐÈ÷°í °³¼±ÇÏ¿© ¸®¼Ò±×·¡ÇÇÀÇ È¿°ú¸¦ ³ôÀÔ´Ï´Ù.
4) Ancillary Lithography Materialsº¸Á¶ÀûÀÎ ¸®¼Ò±×·¡ÇÇ Á¦Ç° ¶óÀξ÷ÀÎ µðº§·ÎÆÛ, ¸®¹«¹ö, ±âŸ ÀÎÇÚ½º¸ÕÆ® Äɹ̽ºÆ®¸®¿¡¼ ÅäÅ» ¸®¼Ò±×·¡ÇǼַμÇÀ» Áö¿øÇÕ´Ï´Ù.
